Mechanism of Wafer Bonding Process

Autoria(s): Han Weihua; Yu Jinzhong; Wang Qiming
Data(s)

2000
Resumo

国家自然科学基金
Identificador

http://ir.semi.ac.cn/handle/172111/18601

http://www.irgrid.ac.cn/handle/1471x/103938
Idioma(s)

英语
Fonte

Han Weihua;Yu Jinzhong;Wang Qiming.Mechanism of Wafer Bonding Process,Semiconductor Photonics and Technology,2000,6(3):169
Palavras-Chave #光电子学
Tipo

期刊论文
Acesso ao item digital