Technology Trend and Challenges in High Power Semiconductor Laser Packaging

Autoria(s): Xingsheng Liu; Wei Zhao
Data(s)

14/01/2010
Identificador

http://ir.opt.ac.cn/handle/181661/8047

http://www.irgrid.ac.cn/handle/1471x/71002
Idioma(s)

中文
Fonte

Xingsheng Liu, Wei Zhao.Technology Trend and Challenges in High Power Semiconductor Laser Packaging.见:59th Electronic Components and Technology Conference (ECTC).San Diego, California USA.2009-05.
Palavras-Chave #电子、电信技术::半导体器件与技术 #Trend and Challenges #High Power Semiconductor Laser #Packaging
Tipo

会议论文
Acesso ao item digital