Bubble dynamics and boiling heat transfer in Microsystems.

Autoria(s): 徐进良; 张伟; 李玉秀
Data(s)

06/08/2010
Identificador

http://ir.giec.ac.cn/handle/344007/2919

http://www.irgrid.ac.cn/handle/1471x/68531
Fonte

徐进良;张伟;李玉秀.Bubble dynamics and boiling heat transfer in Microsystems. .见：.Keynote paper of Sixth Proceedings of Int. Conf. on nanochannels, microchannels, and minichannels, ,,,
Tipo

会议论文
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