AlGaN/GaN/InGaN/GaN DH-HEMTs structure with an AlN interlayer grown by MOCVD


Autoria(s): Tang, J; Wang, XL; Xiao, HL; Ran, JX; Wang, CM; Wang, XY; Hu, GX; Li, JM
Data(s)

2008

Resumo

A novel AlGaN/GaN/GaN/GaN double heterojunction high electron mobility transistors (DH-HEMTS) structure with an AlN interlayer on sapphire substrate has been grown by MOCVD. The structure featured a 6-10 nm In0.1Ga0.9N layer inserted between the GaN channel and GaN buffer. And wer also inserted one ultrathin. AlN interlayer into the Al/GaN/GaN interface, which significantly enhanced the mobility of two-dimensional electron gas (2DEG) existed in the GaN channel. AFM result of this structure shows a good surface morphology and a low dislocation density, with the root-mean-square roughness (RMS) of 0.196 nm for a scan area of 5 mu m x 5 mu m. Temperature dependent Hall measurement was performed on this sample, and a mobility as high as 1950 cm(2)/Vs at room temperature (RT) was obtained. The sheet carrier density was 9.89 x10(12) cm(2), and average sheet resistance of 327 Omega/sq was achieved. The mobility obtained in this paper is about 50% higher than other results of similar structures which have been reported. (c) 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

A novel AlGaN/GaN/GaN/GaN double heterojunction high electron mobility transistors (DH-HEMTS) structure with an AlN interlayer on sapphire substrate has been grown by MOCVD. The structure featured a 6-10 nm In0.1Ga0.9N layer inserted between the GaN channel and GaN buffer. And wer also inserted one ultrathin. AlN interlayer into the Al/GaN/GaN interface, which significantly enhanced the mobility of two-dimensional electron gas (2DEG) existed in the GaN channel. AFM result of this structure shows a good surface morphology and a low dislocation density, with the root-mean-square roughness (RMS) of 0.196 nm for a scan area of 5 mu m x 5 mu m. Temperature dependent Hall measurement was performed on this sample, and a mobility as high as 1950 cm(2)/Vs at room temperature (RT) was obtained. The sheet carrier density was 9.89 x10(12) cm(2), and average sheet resistance of 327 Omega/sq was achieved. The mobility obtained in this paper is about 50% higher than other results of similar structures which have been reported. (c) 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

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[Tang, Jian; Wang, Xiaoliang; Xiao, Hongling; Ran, Junxue; Wang, Cuimei; Wang, Xiaoyan; Hu, Guoxin; Li, Jinmin] Chinese Acad Sci, Inst Semicond, Novel Mat Lab, Beijing 100083, Peoples R China

Identificador

http://ir.semi.ac.cn/handle/172111/7766

http://www.irgrid.ac.cn/handle/1471x/65664

Idioma(s)

英语

Publicador

WILEY-V C H VERLAG GMBH

PAPPELALLEE 3, W-69469 WEINHEIM, GERMANY

Fonte

Tang, J ; Wang, XL ; Xiao, HL ; Ran, JX ; Wang, CM ; Wang, XY ; Hu, GX ; Li, JM .AlGaN/GaN/InGaN/GaN DH-HEMTs structure with an AlN interlayer grown by MOCVD .见:WILEY-V C H VERLAG GMBH .PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS,PAPPELALLEE 3, W-69469 WEINHEIM, GERMANY ,2008,VOL 5,NO 9,5 (9): 2982-2984

Palavras-Chave #半导体材料 #PERFORMANCE #HETEROSTRUCTURES #OPTIMIZATION #MOBILITY
Tipo

会议论文