Effects of annealing time and Si cap layer thickness on the Si/SiGe/Si heterostructures thermal stability


Autoria(s): Gao F; Lin YX; Huang DD; Li JP; Sun DZ; Kong MY; Zeng YP; Li JM; Lin LY
Data(s)

2001

Resumo

The effects of annealing time and Si cap layer thickness: on the thermal stability of the Si/SiGe/Si heterostructures deposited by disilane and solid-Ge molecule beam epitaxy were investigated. It is found that in the same strain state of the SiGe layers the annealing time decreases with increasing Si cap layer thickness. This effect is analyzed by a force-balance theory and an equation has been obtained to characterize the relation between the annealing time and the Si cap layer thickness. (C) 2001 Elsevier Science B.V. All rights reserved.

Identificador

http://ir.semi.ac.cn/handle/172111/12180

http://www.irgrid.ac.cn/handle/1471x/65060

Idioma(s)

英语

Fonte

Gao F; Lin YX; Huang DD; Li JP; Sun DZ; Kong MY; Zeng YP; Li JM; Lin LY .Effects of annealing time and Si cap layer thickness on the Si/SiGe/Si heterostructures thermal stability ,JOURNAL OF CRYSTAL GROWTH,2001 ,227(0 ):766-769

Palavras-Chave #半导体材料 #annealing #molecular beam epitaxy #germanium silicon alloys #semiconducting materials #STRAIN RELAXATION
Tipo

期刊论文