SiGe/Si resonant-cavity-enhanced photodetectors for 1.3 mu m operation fabricated using wafer bonding techniques


Autoria(s): Li C; Huang CJ; Cheng BW; Zuo YH; Luo LP; Yu JZ; Wang QM
Data(s)

2002

Resumo

A SiGe/Si multiple-quantum-well resonant-cavity-enhanced (RCE) photodetector for 1.3 mum operation was fabricated using bonding reflector process. A full width at half maximum (FWHM) of 6 nm and a quantum efficiency of 4.2% at 1314 nm were obtained. Compared to our previously reported SiGe RCE photodetectors fabricated on separation-by-implanted-oxygen wafer, the mirrors in the device can be more easily fabricated and the device can be further optimized. The FWHM is expected to be less than 1 nm and the detector is fit for density wavelength division multiplexing applications. (C) 2002 American Institute of Physics.

Identificador

http://ir.semi.ac.cn/handle/172111/11852

http://www.irgrid.ac.cn/handle/1471x/64896

Idioma(s)

英语

Fonte

Li C; Huang CJ; Cheng BW; Zuo YH; Luo LP; Yu JZ; Wang QM .SiGe/Si resonant-cavity-enhanced photodetectors for 1.3 mu m operation fabricated using wafer bonding techniques ,JOURNAL OF APPLIED PHYSICS,2002,92 (3):1718-1720

Palavras-Chave #半导体物理
Tipo

期刊论文