Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices


Autoria(s): Zhu NH; Liu Y; Zhang SJ; Wen JM
Data(s)

2006

Resumo

The effect of bonding-wire compensation on the capacitances of both the submount and the laser diode is demonstrated in this paper. The measured results show that the small-signal magnitude-frequency responses of the TO packaged laser and photodiode modules can be improved by properly choosing the length of the bonding wire. After packaging, the phase-frequency responses of the laser modules can also be significantly improved (c) 2005 Wiley Periodicals, Inc.

Identificador

http://ir.semi.ac.cn/handle/172111/10912

http://www.irgrid.ac.cn/handle/1471x/64652

Idioma(s)

英语

Fonte

Zhu NH; Liu Y; Zhang SJ; Wen JM .Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices ,MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,2006,48(1):76-79

Palavras-Chave #光电子学 #packaging #photodiode #semiconductor laser #S-parameter measurement #DESIGN
Tipo

期刊论文