Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices
Data(s) |
2006
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Resumo |
The effect of bonding-wire compensation on the capacitances of both the submount and the laser diode is demonstrated in this paper. The measured results show that the small-signal magnitude-frequency responses of the TO packaged laser and photodiode modules can be improved by properly choosing the length of the bonding wire. After packaging, the phase-frequency responses of the laser modules can also be significantly improved (c) 2005 Wiley Periodicals, Inc. |
Identificador | |
Idioma(s) |
英语 |
Fonte |
Zhu NH; Liu Y; Zhang SJ; Wen JM .Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices ,MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,2006,48(1):76-79 |
Palavras-Chave | #光电子学 #packaging #photodiode #semiconductor laser #S-parameter measurement #DESIGN |
Tipo |
期刊论文 |