半导体硅衬底上氧化铝介电薄膜硅离子注入腐蚀方法


Autoria(s): 王启元; 王俊; 王建华
Data(s)

13/06/2007

Resumo

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Identificador

http://ir.semi.ac.cn/handle/172111/3751

http://www.irgrid.ac.cn/handle/1471x/61357

Idioma(s)

中文

Fonte

王启元;王俊;王建华,半导体硅衬底上氧化铝介电薄膜硅离子注入腐蚀方法 ,200510126243,20051130

Tipo

专利