倒装氮化镓基发光二极管芯片的制作方法


Autoria(s): 李丙乾; 张书明; 杨辉
Data(s)

31/05/2006

Resumo

Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-06-04T08:36:34Z No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5)

Made available in DSpace on 2009-06-04T08:36:35Z (GMT). No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5) Previous issue date: 2008-08

Made available in DSpace on 2009-06-11T08:57:54Z (GMT). No. of bitstreams: 1 full/200410095294.pdf: 531083 bytes, checksum: c1abe1057902d05e1542d17ac2560359 (MD5) Previous issue date:

Identificador

http://ir.semi.ac.cn/handle/172111/3455

http://www.irgrid.ac.cn/handle/1471x/61209

Idioma(s)

中文

Fonte

李丙乾;张书明;杨辉,倒装氮化镓基发光二极管芯片的制作方法,200410095294,20041119

Tipo

专利