半导体薄片材料的横向研磨方法
| Data(s) |
09/08/2006
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| Resumo |
Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-06-04T08:36:34Z No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5) Made available in DSpace on 2009-06-04T08:36:35Z (GMT). No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5) Previous issue date: 2008-08 Made available in DSpace on 2009-06-11T08:57:51Z (GMT). No. of bitstreams: 1 full/200510006190.pdf: 435218 bytes, checksum: fe27cee53195b6feff6f06d75ecbdbca (MD5) Previous issue date: |
| Identificador | |
| Idioma(s) |
中文 |
| Fonte |
陈弘达;裴为华,半导体薄片材料的横向研磨方法,200510006190,20050131 |
| Tipo |
专利 |
