采用双层结构的混合集成光路芯片


Autoria(s): 陈鹏; 刘育梁; 李芳
Data(s)

26/07/2006

Resumo

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Made available in DSpace on 2009-06-04T08:36:35Z (GMT). No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5) Previous issue date: 2008-08

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Identificador

http://ir.semi.ac.cn/handle/172111/3379

http://www.irgrid.ac.cn/handle/1471x/61171

Idioma(s)

中文

Fonte

陈鹏;刘育梁;李芳,采用双层结构的混合集成光路芯片,200510011211,20050120

Tipo

专利