半导体激光器高频封装用具有微带结构的热沉
| Data(s) |
26/04/2006
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| Resumo |
Submitted by zhangdi (zhangdi@red.semi.ac.cn) on 2009-06-04T08:36:34Z No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5) Made available in DSpace on 2009-06-04T08:36:35Z (GMT). No. of bitstreams: 1 dspace.cfg: 33388 bytes, checksum: ac9630d3fdb36a155287a049e8b34eb7 (MD5) Previous issue date: 2008-08 Made available in DSpace on 2009-06-11T08:57:48Z (GMT). No. of bitstreams: 1 full/200410083868.pdf: 330515 bytes, checksum: a05ec31c67f20f4c080a41c1ca5b0af0 (MD5) Previous issue date: |
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| Idioma(s) |
中文 |
| Fonte |
张尚剑;祝宁华,半导体激光器高频封装用具有微带结构的热沉 ,CN200410083868.9,20041020 |
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专利 |
