大功率半导体激光器阵列的封装技术

半导体激光器阵列的应用已基本覆盖了整个光电子领域，成为当今光电子科学的重要技术。本文介绍了半导体激光器阵列的发展及其应用。着重阐述了半导体激光器阵列的封装技术——热沉材料的选择及其结构优化、热沉与半导体激光器阵列之间的焊接技术、半导体激光器阵列的冷却技术、与光纤的耦合技术等。

The semiconductor laser arrays are applied almost in all photoelectronics fields, and becoming an important technique in optoelectronics science at present. The development and application of semiconductor laser arrays are introduced, and the status of packaging techniques is stressed. The packaging techniques include the materials choosing and the structure optimizing of heatsinks, the bonding between the array and the heatsink, the cooling and the fiber coupling, etc.