Determination of interface properties between micron-thick metal film and ceramic substrate using peel test


Autoria(s): 赵海峰; 魏悦广
Data(s)

2007

Resumo

Peel test measurements have been performed to estimate both the interface toughness and the separation strength between copper thin film and Al2O3 substrate with film thicknesses ranging between 1 and 15 mu m. An inverse analysis based on the artificial neural network method is adopted to determine the interface parameters. The interface parameters are characterized by the cohesive zone (CZ) model. The results of finite element simulations based on the strain gradient plasticity theory are used to train the artificial neural network. Using both the trained neural network and the experimental measurements for one test result, both the interface toughness and the separation strength are determined. Finally, the finite element predictions adopting the determined interface parameters are performed for the other film thickness cases, and are in agreement with the experimental results.

Identificador

http://dspace.imech.ac.cn/handle/311007/33955

http://www.irgrid.ac.cn/handle/1471x/2826

Idioma(s)

英语

Fonte

International Journal of Fracture.2007,144(2):103-112

Palavras-Chave #Interfacial Toughness #Metal Thin Film #Peel Test #Cohesive Zone Model #Inverse Analysis #Strain Gradient Plasticity #State Crack-Growth #Cu/Cr/Polyimide System #Adhesive Joints #Fracture Energy #Strength #Layer #Work #Simulations #Surface
Tipo

期刊论文