微米尺度结构最大抗扭强度的在线测试和研究

<span style="color: rgb(0, 0, 0); font-family: verdana, Arial, Helvetica, sans-serif; font-size: 13px;">提出了一种新型的测试结构，对面积为微米量级下键合的最大抗扭强度进行了测试) 实验设计一系列的单晶硅悬臂梁结构测试键合面积在微米量级时的最大剪切力，键合面为常用的矩形其边长从*!+ 到!#$!+，并根据实际移动距离计算得出的最大剪切力) 并实验实际得出最大剪切扭矩和相应的键合面积的曲线，以及最大扭转剪切破坏应力与悬臂梁加载距离的关系，并针对*$!+, *$!+ 的矩形键合结构进行了加载和位移的重复性实验测量，两次测量结果符合较好) 微电子机械系统（+-./0121.3/0+1.456-.52 78731+，9:9;）器件的设计人员可以根据结论曲线，针对所需的抗扭强度设计相应的键合面积，为9:9; 器件工艺的在线定量测试与设计提供参考)</span>

In the design and fabrication of microelectronic system(MEMS) devices, the process based on silicon is a main technolog which draws great attention of researchers. Bonding technology including silicon to glass and silicon to silicon is fundamental for bulk silicon MEMS devices. For MEMS devices, the bonding area is from the micrometer to millimeter scale, thus traditional methods to test bonding strength are no longer feasible. Measuring the strength at that scale has become the bottle-neck for MEMS development. We first define a new way, with which a series of single crystal cantilever beam was taken to test the maxal shear stress of bonding strength in the micro area. The experiment gives curves of torsional strength versus the bonding area and torsional strength versus the probe movement distance, the designer can use them to determine the bonding area according to the required torque for their MEMS devices.