The Effect of Periodic Segmentation Cracks on the Interfacial Debonding: Study on Interfacial Stresses


Autoria(s): 吴臣武; 陈光南; 张坤; 罗耕星; 梁乃刚
Data(s)

2006

Resumo

Hard coatings on relatively soft substrate always face the danger of debonding along the interface. Interfacial stresses are considered to be the initial driving force for the interfacial debonding of the relatively strong bonded coatings. Interfacial stresses due to the mismatch of strain between the coating and substrate are simulated with FEM firstly. The distribution of the interfacial stresses is achieved, which confirms an excessive stresses concentration near the interface end. Subsequently, the redistribution of interfacial stresses is calculated for a coating with periodic segmentation cracks. Results indicate that the distribution of interfacial stresses is altered greatly with the periodic segmentation cracks. To reveal the effect of the spacing of the periodic segmentation cracks on the distribution of interfacial stresses, different crack density is modeled within the coating. It is found that that the peak values of the interfacial stresses decrease with the increase of crack density, i.e. with reduction of spacing of segmentation cracks.

Identificador

http://dspace.imech.ac.cn/handle/311007/16487

http://www.irgrid.ac.cn/handle/1471x/1142

Idioma(s)

英语

Palavras-Chave #力学
Tipo

期刊论文