Water Vapor Barrier Material by Covalent Self-Assembly for Organic Device Encapsulation
Data(s) |
2014
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Resumo |
Development of barrier materials for organic device encapsulation is of key interest for the commercialization of organic electronics. In this work, we have fabricated barrier films with ultralow water vapor permeabilities by reactive layer-by-layer approach. Using this technique, alternative layers of polyethylene imine and stearic acid were covalently bonded on a Surlyn film. The roughness, transparency and thickness of the films were determined by atomic force microscopy, UV-visible spectroscopy and scanning electron microscopy, respectively. Water vapor transmission rates through these films and the ability of these films to protect the organic photovoltaic devices was investigated. The films with covalently assembled bilayers exhibited lower water vapor transmission rates and maintained higher organic photovoltaic device efficiencies compared to the neat Surlyn film. |
Formato |
application/pdf |
Identificador |
http://eprints.iisc.ernet.in/50576/1/ind_eng_che_res_53-46_17894_2014.pdf Kopanati, Gayathri N and Seethamraju, Sindhu and Ramamurthy, Praveen C and Madras, Giridhar (2014) Water Vapor Barrier Material by Covalent Self-Assembly for Organic Device Encapsulation. In: INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 53 (46). pp. 17894-17900. |
Publicador |
AMER CHEMICAL SOC |
Relação |
http://dx.doi.org/ 10.1021/ie5036995 http://eprints.iisc.ernet.in/50576/ |
Palavras-Chave | #Chemical Engineering #Materials Engineering (formerly Metallurgy) #Centre for Nano Science and Engineering |
Tipo |
Journal Article PeerReviewed |