Modelling of transient heat conduction with diffuse interface methods


Autoria(s): Ettrich, J; Choudhury, A; Tschukin, O; Schoof, E; August, A; Nestler, B
Data(s)

2014

Resumo

We present a survey on different numerical interpolation schemes used for two-phase transient heat conduction problems in the context of interface capturing phase-field methods. Examples are general transport problems in the context of diffuse interface methods with a non-equal heat conductivity in normal and tangential directions to the interface. We extend the tonsorial approach recently published by Nicoli M et al (2011 Phys. Rev. E 84 1-6) to the general three-dimensional (3D) transient evolution equations. Validations for one-dimensional, two-dimensional and 3D transient test cases are provided, and the results are in good agreement with analytical and numerical reference solutions.

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/50513/1/mod_sim_mat_sci_eng_22-8_2014.pdf

Ettrich, J and Choudhury, A and Tschukin, O and Schoof, E and August, A and Nestler, B (2014) Modelling of transient heat conduction with diffuse interface methods. In: MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 22 (8).

Publicador

IOP PUBLISHING LTD

Relação

http://dx.doi.org/ 10.1088/0965-0393/22/8/085006

http://eprints.iisc.ernet.in/50513/

Palavras-Chave #Materials Engineering (formerly Metallurgy)
Tipo

Journal Article

PeerReviewed