Mechanical and thermal modeling of In-Cu composites for thermal interface materials applications
Data(s) |
2014
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Resumo |
In-Cu composite solders have been proposed as an effective thermal interface material. Here, finite element analysis and theoretical treatment of their mechanical and thermal behavior is presented. It was determined that the stresses and the strains were concentrated in the narrow and wider In channels, respectively. Furthermore, it is suggested that an In-Cu composite with disk-shaped Cu inclusions may not only further improve the thermal conductivity but may also reduce the stiffness of In-Cu composites in shear. |
Formato |
application/pdf |
Identificador |
http://eprints.iisc.ernet.in/49224/1/jl_comp_mat_48-11_1391_2014.pdf Kumar, Praveen and Awasthi, Sandeep (2014) Mechanical and thermal modeling of In-Cu composites for thermal interface materials applications. In: JOURNAL OF COMPOSITE MATERIALS, 48 (11). pp. 1391-1398. |
Publicador |
SAGE PUBLICATIONS LTD |
Relação |
http://dx.doi.org/10.1177/0021998313486502 http://eprints.iisc.ernet.in/49224/ |
Palavras-Chave | #Materials Engineering (formerly Metallurgy) |
Tipo |
Journal Article PeerReviewed |