Physiological and subjective thermal response from Indians


Autoria(s): Maiti, Rina
Data(s)

2013

Resumo

A controlled laboratory experiment was carried out on forty Indian male college students for evaluating the effect of indoor thermal environment on occupants' response and thermal comfort. During experiment, indoor temperature varied from 21 degrees C to 33 degrees C, and the variables like relative humidity, airflow, air temperature and radiant temperature were recorded along with skin (T-sk) and oral temperature (T-core) from the subjects. From T-sk and T-c, body temperature (T-b) was evaluated. Subjective Thermal Sensation Vote (TSV) was recorded using ASHRAE 7-point scale. In PMV model, Fanger's T-sk equation was used to accommodate adaptive response. Stepwise regression analysis result showed T-b was better predictor of TSV than T-sk and T-core. Regional skin temperature response, lower sweat threshold temperature with no dipping sweat and higher cutaneous sweating threshold temperature were observed as thermal adaptive responses. Using PMV model, thermal comfort zone was evaluated as (22.46-25.41) degrees C with neutral temperature of 23.91 degrees C, whereas using TSV response, wider comfort zone was estimated as (23.25-2632) degrees C with neutral temperature at 24.83 degrees C. It was observed that PMV-model overestimated the actual thermal response. Interestingly, these subjects were found to be less sensitive to hot but more sensitive to cold. A new TSV-PPD relation (PPDnew) was obtained with an asymmetric distribution of hot-cold thermal sensation response in Indians. (C) 2013 Elsevier Ltd. All rights reserved.

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/48143/1/Bui_Env_70_306_2013.pdf

Maiti, Rina (2013) Physiological and subjective thermal response from Indians. In: BUILDING AND ENVIRONMENT, 70 . pp. 306-317.

Publicador

PERGAMON-ELSEVIER SCIENCE LTD

Relação

http://dx.doi.org/10.1016/j.buildenv.2013.08.029

http://eprints.iisc.ernet.in/48143/

Palavras-Chave #Centre for Product Design & Manufacturing
Tipo

Journal Article

PeerReviewed