Interdiffusion studies in bulk Au-Ti system


Autoria(s): Kumar, AK; Paul, A
Data(s)

01/11/2010

Resumo

The performance of the contacts, where Au/Ti layers are used in the metallization scheme, largely depends on the product phases grown by interdiffusion at the interface. It is found that four intermetallic compounds grow with narrow homogeneity range and wavy interfaces in the interdiffusion zone. The presence of wavy interfaces is the indication of high anisotropy in diffusion of the product phases. This also reflects in the deviation of parabolic growth from the average. Further, we have determined the relevant diffusion parameters, such as interdiffusion coefficient in the penetrated region of the end members and integrated diffusion coefficients of the intermetallic compounds.

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/33657/1/Interdifussion.pdf

Kumar, AK and Paul, A (2010) Interdiffusion studies in bulk Au-Ti system. In: Journal of Materials Science: Materials in Electronics, 21 (11). pp. 1202-1206.

Publicador

Springer

Relação

http://www.springerlink.com/content/1q5685u183038873/

http://eprints.iisc.ernet.in/33657/

Palavras-Chave #Electronic Systems Engineering (Formerly, (CEDT) Centre for Electronic Design & Technology) #Materials Engineering (formerly Metallurgy)
Tipo

Journal Article

PeerReviewed