On the effect of stacking fault energy on the thermal activation of attractive juntions in the low-temperature creep of F.C.C. metals
| Data(s) |
01/03/1970
|
|---|---|
| Formato |
application/pdf |
| Identificador |
http://eprints.iisc.ernet.in/28232/1/save.pdf Prasad, YVRK and Sastry, DH and Vasu, KI (1970) On the effect of stacking fault energy on the thermal activation of attractive juntions in the low-temperature creep of F.C.C. metals. In: Scripta Metallurgica, 4 (3). pp. 219-220. |
| Publicador |
Elsevier Science |
| Relação |
http://dx.doi.org/10.1016/0036-9748(70)90196-1 http://eprints.iisc.ernet.in/28232/ |
| Palavras-Chave | #Materials Engineering (formerly Metallurgy) |
| Tipo |
Journal Article PeerReviewed |
