On the low temperature deformation mechanism in polycrystalline cadmium
Data(s) |
01/12/1969
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Resumo |
The thermally activated plastic flow of polycrystalline cadmium was investigated by differentialstress creep tests at 86°K and tensile tests in the temperature range 86°–473°K. The activation energy (0.55 eV) at zero effective stress and the activation volume as a function of effective stress were obtained. It is concluded that intersection of glide and forest dislocations becomes rate controlling for low temperature deformation. The approximate stacking-fault width in cadmium is deduced to be “1.5b”. |
Formato |
application/pdf |
Identificador |
http://eprints.iisc.ernet.in/27612/1/16.pdf Sastry, DH and Prasad, YVRK and Vasu, KI (1969) On the low temperature deformation mechanism in polycrystalline cadmium. In: Acta Metallurgica, 17 (12). pp. 1453-1457. |
Publicador |
Elsevier Science |
Relação |
http://dx.doi.org/10.1016/0001-6160(69)90009-1 http://eprints.iisc.ernet.in/27612/ |
Palavras-Chave | #Materials Engineering (formerly Metallurgy) |
Tipo |
Journal Article PeerReviewed |