On the low temperature deformation mechanism in polycrystalline cadmium


Autoria(s): Sastry, DH; Prasad, YVRK; Vasu, KI
Data(s)

01/12/1969

Resumo

The thermally activated plastic flow of polycrystalline cadmium was investigated by differentialstress creep tests at 86°K and tensile tests in the temperature range 86°–473°K. The activation energy (0.55 eV) at zero effective stress and the activation volume as a function of effective stress were obtained. It is concluded that intersection of glide and forest dislocations becomes rate controlling for low temperature deformation. The approximate stacking-fault width in cadmium is deduced to be “1.5b”.

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/27612/1/16.pdf

Sastry, DH and Prasad, YVRK and Vasu, KI (1969) On the low temperature deformation mechanism in polycrystalline cadmium. In: Acta Metallurgica, 17 (12). pp. 1453-1457.

Publicador

Elsevier Science

Relação

http://dx.doi.org/10.1016/0001-6160(69)90009-1

http://eprints.iisc.ernet.in/27612/

Palavras-Chave #Materials Engineering (formerly Metallurgy)
Tipo

Journal Article

PeerReviewed