Kinetics of Chemical Vapor Deposition


Autoria(s): Subrahmanyam, J; Lahiri, AK; Abraham, KP
Data(s)

01/06/1980

Resumo

A generalized mass transport model is developed for predicting the rate ofdeposition in chemical vapor deposition (CVD) systems. This combines thegeneralized method of obtaining equilibrium composition, with elemental fluxbalance expressions. This procedure avoids the usual problems encountered incalculating the rates in multicomponent systems, like writing overall reactionschemes. The dependence of multicomponent diffusivities on the fluxes is accountedin this model using an iterative procedure. The model developed isapplied to the deposition of titanium carbide on cemented carbide tool bitsfrom a gas mixture of titanium tetrachloride, toluene, and hydrogen. Experimentaldeposition rates were obtained using a thermogravimetric assembly.Mass transport controlled rates give an order of magnitude estimates of theobserved rates.

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/21620/1/fulltext.pdf

Subrahmanyam, J and Lahiri, AK and Abraham, KP (1980) Kinetics of Chemical Vapor Deposition. In: Journal of Electrochemical Society, 127 (6). pp. 1394-1399.

Publicador

The Electrochemical Society, Inc.

Relação

http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JESOAN000127000006001394000001&idtype=cvips&gifs=yes

http://eprints.iisc.ernet.in/21620/

Palavras-Chave #Materials Engineering (formerly Metallurgy)
Tipo

Journal Article

PeerReviewed