996 resultados para Embedded electronic


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Embedded electronic systems in vehicles are of rapidly increasing commercial importance for the automotive industry. While current vehicular embedded systems are extremely limited and static, a more dynamic configurable system would greatly simplify the integration work and increase quality of vehicular systems. This brings in features like separation of concerns, customised software configuration for individual vehicles, seamless connectivity, and plug-and-play capability. Furthermore, such a system can also contribute to increased dependability and resource optimization due to its inherent ability to adjust itself dynamically to changes in software, hardware resources, and environment condition. This paper describes the architectural approach to achieving the goals of dynamically self-configuring automotive embedded electronic systems by the EU research project DySCAS. The architecture solution outlined in this paper captures the application and operational contexts, expected features, middleware services, functions and behaviours, as well as the basic mechanisms and technologies. The paper also covers the architecture conceptualization by presenting the rationale, concerning the architecture structuring, control principles, and deployment concept. In this paper, we also present the adopted architecture V&V strategy and discuss some open issues in regards to the industrial acceptance.

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This paper, chosen as a best paper from the 2004 SAMOS Workshop on Computer Systems: describes a novel, efficient methodology for automatically creating embedded DSP computer systems. The novelty arises since now embedded electronic signal processing systems, such as radar or sonar, can be designed by anyone from the algorithm level, i.e. no low level system design experience is required, whilst still achieving low controllable implementation overheads and high real time performance. In the chosen design example, a bank of Normalised Lattice Filter (NLF) components is created which a four-fold reduction in the required processing resource with no performance decrease.

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ARAUJO, Márcio V. ; ALSINA, Pablo J. ; MEDEIROS, Adelardo A. D. ; PEREIRA, Jonathan P.P. ; DOMINGOS, Elber C. ; ARAÚJO, Fábio M.U. ; SILVA, Jáder S. . Development of an Active Orthosis Prototype for Lower Limbs. In: INTERNATIONAL CONGRESS OF MECHANICAL ENGINEERING, 20., 2009, Gramado, RS. Proceedings… Gramado, RS: [s. n.], 2009

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This work presents the development of a prototype of an intelligent active orthosis for lower limbs whit an electronic embedded system. The proposed orthosis is an orthopedical device with the main objective of providing walking capacity to people with partial or total loss of lower limbs movements. In order to design the kinematics, dynamics and the mechanical characteristics of the prototype, the biomechanics of the human body was analized. The orthosis was projected to reproduce some of the movements of the human gait as walking in straight forward, sit down, get up, arise and go down steps. The joints of the orthosis are controlled by DC motors equipped with mechanical reductions, whose purpose is to reduce rotational speed and increase the torque, thus generating smooth movements. The electronic embedded system is composed of two motor controller boards with two channels that communicate with a embedded PC, position sensors and limit switches. The gait movements of the orthosis will be controlled by high level commands from a human-machine interface. The embedded electronic system interprets the high level commands, generates the angular references for the joints of the orthosis, controls and drives the actuators in order to execute the desired movements of the user

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Pós-graduação em Agronomia (Energia na Agricultura) - FCA

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En la actualidad se estudia en numerosos campos cómo automatizar distintas tareas ejecutadas por aeronaves con tripulación humana. Estas tareas son en todos los casos muy costosos, debido al gran consumo de combustible, gran coste de adquisición y mantenimiento de la propia aeronave, todo ello sin contar el riesgo para los mismos tripulantes. Como ejemplo de estas tareas se puede incluir la vigilancia policial y fronteriza, revisiones de tendidos de alta tensión, la alerta temprana de incendios forestales y la medición de parámetros contaminantes. El objetivo de este proyecto es el diseño y la construcción de un prototipo electrónico empotrado basado en microcontrolador con núcleo C8051 de Silicon labs, que sea capaz de gobernar una aeronave de radiocontrol de forma transparente, de manera que en un futuro se pueda sustituir el propio aeromodelo, con la modificación de algunos parámetros, para poder incorporar sistemas de video o distintos medios de detección de variables. El prototipo seguirá una ruta confeccionada y transferida como un archivo de texto con un formato determinado que contendrá los datos necesarios para poder navegar mediante GPS. El trabajo con los modelos de motorización térmica (motores de combustión interna tipo glow, en este caso) resulta peligroso debido a la gran energía que son capaces de alcanzar. A fin de mantener la máxima seguridad durante la evolución del proyecto, se ha diseñado un proceso de tres partes independientes que permitan la correcta familiarización de los distintos componentes que se emplearán. Las fases son las siguientes: 1. Test y modelado de todos los componentes mediante pequeños montajes con protoboard de inserción y programas individuales. Se realizará mediante una tarjeta multipropósito que contendrá un microcontrolador similar en características, aunque de menor complejidad, al del prototipo final. 2. Integración de todos los componentes mediante una tarjeta especialmente diseñada que servirá de interfaz entre la tarjeta multipropósito y todo el hardware necesario para el control de un vehículo terrestre de iguales características (actuadores y motorización) al aeromodelo. 3. Diseño de un sistema embebido que concentre todos los subsistemas desarrollados en las fases anteriores y que integre todos los componentes necesarios para el gobierno de una aeronave de ala fija. ABSTRACT. Nowadays, the way of automating different tasks done by manned vehicles is studied. These tasks are any case very expensive, due to large fuel consumption, costs of aircraft buying, without taking into account the risk for human crew. As an example of these tasks, we can include policing or border surveillance, maintenance of high voltage lines, early warning of forest fire and measuring of pollution parameters. The target of this project is the design and construction of an embedded electronic prototype, based on a microcontroller with C8051 core from Silicon labs, and it will be able to controlling an aircraft transparently, in order that in the future the flying model could be changed with the modification of some parameters, and video or any variables detection systems could be added. The prototype will follow a designed and transferred path as an plain text file with a given format, that will contain all the necessary data for GPS navigation. Working with heat engine models (internal combustion engine, glow type, in this case) becomes dangerous due to the large energy that can be able to acquire. In order to keep the maximum safety level during the project evolution a three independent stages process have been designed, this allows familiarizing properly with the parts that will be used. The stages are as follows: 1. Test and modeling of all of the parts by little assemblies with through-hole protoboard and stand alone programs. It will be done with a multipurpose card which contains a microcontroller of similar characteristics, although less complex, of the final prototype. 2. Integrating of all of parts through a dedicated design card that will serve as interface between multipurpose card and all the necessary hardware for controlling a ground vehicle with the same characteristics (actuators and engine) of the flying model. 3. Embedded system designing that contains all the developed subsystems in the previous stages and integrates all the necessary parts for controlling a fixed-wing aircraft.

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ARAUJO, Márcio V. ; ALSINA, Pablo J. ; MEDEIROS, Adelardo A. D. ; PEREIRA, Jonathan P.P. ; DOMINGOS, Elber C. ; ARAÚJO, Fábio M.U. ; SILVA, Jáder S. . Development of an Active Orthosis Prototype for Lower Limbs. In: INTERNATIONAL CONGRESS OF MECHANICAL ENGINEERING, 20., 2009, Gramado, RS. Proceedings… Gramado, RS: [s. n.], 2009

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ARAUJO, Márcio V. ; ALSINA, Pablo J. ; MEDEIROS, Adelardo A. D. ; PEREIRA, Jonathan P.P. ; DOMINGOS, Elber C. ; ARAÚJO, Fábio M.U. ; SILVA, Jáder S. . Development of an Active Orthosis Prototype for Lower Limbs. In: INTERNATIONAL CONGRESS OF MECHANICAL ENGINEERING, 20., 2009, Gramado, RS. Proceedings… Gramado, RS: [s. n.], 2009

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Emails have become a central genre in business communication, reflecting both how people communicate and how they go about their professional practices. This chapter examines embedded business emails as reflections of the professional practices of the regulatory and policy department of a multinational based in London, UK. It argues that the nature of online communication in international organisations, with its high levels of intertextuality and interdiscursivity, requires multidimensional analytical approaches that are capable of capturing its complexity and dynamics. To this end, the chapter introduces electronic discourse analysis networks (EDANs) as one example of such approaches. It begins with a brief review of the literature that has informed the study reported on here before it discusses EDANs as its analytical framework. Using a group of embedded emails and a number of networked data sets, the chapter shows how EDANs can be used to further our understanding of professional online communication.

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Defence organisations perform information security evaluations to confirm that electronic communications devices are safe to use in security-critical situations. Such evaluations include tracing all possible dataflow paths through the device, but this process is tedious and error-prone, so automated reachability analysis tools are needed to make security evaluations faster and more accurate. Previous research has produced a tool, SIFA, for dataflow analysis of basic digital circuitry, but it cannot analyse dataflow through microprocessors embedded within the circuit since this depends on the software they run. We have developed a static analysis tool that produces SIFA compatible dataflow graphs from embedded microcontroller programs written in C. In this paper we present a case study which shows how this new capability supports combined hardware and software dataflow analyses of a security critical communications device.

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This chapter is concerned with innovation that involves creative cultural occupations, but not within the creative industries. Rather, we examine the operation of cultural creative occupations that exist outside the creative industries - so-called 'embedded creatives' who work across all industry sectors (Cunningham and Higgs 2009). In doing so, we concur with Bilton (2007) that the separation of creative industries from other industries is a 'false step'. All industries must be innovative; however, they also must be able to combine both scientific and artistic creativity, and that creativity comes from the intersection of different thinking styles (Kurtzberg 2005). Moreover, we suggest that there are now detailed empirical studies, as well as a nascent theoretical base, to suggest that the transdisciplinarity which results from embedded cultural creativity is an engine of growth in the broader economy. Thus, it is relevant to both policymakers and managers. This chapter addresses the following questions: What is the role and significance of the embedded creative? Given a paucity of detailed empirical work in the area to date, what can be deduced from what extant literature there is about the nature of employment and management of these workers? And what are the practical implications of these consideration?

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One of the foremost design considerations in microelectronics miniaturization is the use of embedded passives which provide practical solution. In a typical circuit, over 80 percent of the electronic components are passives such as resistors, inductors, and capacitors that could take up to almost 50 percent of the entire printed circuit board area. By integrating passive components within the substrate instead of being on the surface, embedded passives reduce the system real estate, eliminate the need for discrete and assembly, enhance electrical performance and reliability, and potentially reduce the overall cost. Moreover, it is lead free. Even with these advantages, embedded passive technology is at a relatively immature stage and more characterization and optimization are needed for practical applications leading to its commercialization.This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated. Embedded capacitors in this study are made with polymer/ceramic nanocomposite (BaTiO3) material to take advantage of low processing temperature of polymers and relatively high dielectric constant of ceramics and the values of these capacitors range from 50 pF to 1.5 nF with capacitance per area of approximately 1.5 nF/cm(2). Limited high frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards were carried out. Resistors used in this work have been of three types: 1) carbon ink based polymer thick film (PTF), 2) resistor foils with known sheet resistivities which are laminated to printed wiring board (PWB) during a sequential build-up (SBU) process and 3) thin-film resistor plating by electroless method. Realization of embedded resistors on conventional board-level high-loss epoxy (similar to 0.015 at 1 GHz) and proposed low-loss BCB dielectric (similar to 0.0008 at > 40 GHz) has been explored in this study. Ni-P and Ni-W-P alloys were plated using conventional electroless plating, and NiCr and NiCrAlSi foils were used for the foil transfer process. For the first time, Benzocyclobutene (BCB) has been proposed as a board level dielectric for advanced System-on-Package (SOP) module primarily due to its attractive low-loss (for RF application) and thin film (for high density wiring) properties.Although embedded passives are more reliable by eliminating solder joint interconnects, they also introduce other concerns such as cracks, delamination and component instability. More layers may be needed to accommodate the embedded passives, and various materials within the substrate may cause significant thermo -mechanical stress due to coefficient of thermal expansion (CTE) mismatch. In this work, numerical models of embedded capacitors have been developed to qualitatively examine the effects of process conditions and electrical performance due to thermo-mechanical deformations.Also, a prototype working product with the board level design including features of embedded resistors and capacitors are underway. Preliminary results of these are presented.

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The quest for novel two-dimensional materials has led to the discovery of hybrids where graphene and hexagonal boron nitride (h-BN) occur as phase-separated domains. Using first-principles calculations, we study the energetics and electronic and magnetic properties of such hybrids in detail. The formation energy of quantum dot inclusions (consisting of n carbon atoms) varies as 1/root n, owing to the interface. The electronic gap between the occupied and unoccupied energy levels of quantum dots is also inversely proportional to the length scale, 1/root n-a feature of confined Dirac fermions. For zigzag nanoroads, a combination of the intrinsic electric field caused by the polarity of the h-BN matrix and spin polarization at the edges results in half-metallicity; a band gap opens up under the externally applied ``compensating'' electric field. For armchair nanoroads, the electron confinement opens the gap, different among three subfamilies due to different bond length relaxations at the interfaces, and decreasing with the width.

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In this paper we develop an analytical heat transfer model, which is capable of analyzing cyclic melting and solidification processes of a phase change material used in the context of electronics cooling systems. The model is essentially based on conduction heat transfer, with treatments for convection and radiation embedded inside. The whole solution domain is first divided into two main sub-domains, namely, the melting sub-domain and the solidification sub-domain. Each sub-domain is then analyzed for a number of temporal regimes. Accordingly, analytical solutions for temperature distribution within each subdomain are formulated either using a semi-infinity consideration, or employing a method of quasi-steady state, depending on the applicability. The solution modules are subsequently united, leading to a closed-form solution for the entire problem. The analytical solutions are then compared with experimental and numerical solutions for a benchmark problem quoted in the literature, and excellent agreements can be observed.