Analysis of a Novel MOEM Race Track Resontor based Vibration Sensor

In this paper we analyze a novel Micro Opto Electro Mechanical Systems (MOEMS) race track resonator based vibration sensor. In this vibration sensor the straight portion of a race track resonator is located at the foot of the cantilever beam with proof mass. As the beam deflects due to vibration, stress induced refractive change in the waveguide located over the beam lead to the wavelength shift providing the measure of vibration. A wavelength shift of 3.19 pm/g in the range of 280 g for a cantilever beam of 1750μm×450m×20μmhas been obtained. The maximum acceleration (breakdown) for these dimensions is 2900g when a safety factor of 2 is taken into account. Since the wavelength of operation is around 1.55μm hybrid integration of source and detector is possible on the same substrate. Also it is less amenable to noise as wavelength shift provides the sensor signal. This type of sensors can be used for aerospace application and other harsh environments with suitable design.

Wireless Sensor Networks for Organizational Network Analysis

Since their emergence, wireless sensor networks (WSNs) have become increasingly popular in the pervasive computing industry. This is particularly true within the past five years, which has seen sensor networks being adapted for wide variety of applications. Most of these applications are restricted to ambience monitoring and military use, however, very few commercial sensor applications have been explored till date. For WSNs to be truly ubiquitous, many more commercial sensor applications are yet to be investigated. As an effort to probe for such an application, we explore the potential of using WSNs in the field of Organizational Network Analysis (ONA). In this short paper, we propose a WSN based framework for analyzing organizational networks. We describe the role of WSNs in learning relationships among the people of an organization and investigate the research challenges involved in realizing the proposed framework.

MEMS based pressure sensor with triple modular redundancy

In this paper, the design and development of micro electro mechanical systems (MEMS) based pressure sensor with triple modular redundancy (TMR) for space applications has been presented. In order to minimize the mass of the system and also to avoid the uncertainty in the pressure measurement of the three independent hardware, an integrated approach with TMR is adopted. Sequential steps of TMR logic followed and the test results obtained are included.

Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration

The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, optical, and sensor functions integrated in a single package/module. The goal of this effort is to develop a platform substrate technology providing very high wiring density and embedded thin film passive and active components using PWB compatible materials and processes. The latest SOP baseline process test vehicle has been fabricated on novel Si-matched CTE, high modulus C-SiC composite core substrates using 10mum thick BCB dielectric films with loss tangent of 0.0008 and dielectric constant of 2.65. A semi-additive plating process has been developed for multilayer microvia build-up using BCB without the use of any vacuum deposition or polishing/CMP processes. PWB and package substrate compatible processes such as plasma surface treatment/desmear and electroless/electrolytic pulse reverse plating was used. The smallest line width and space demonstrated in this paper is 6mum with microvia diameters in the 15-30mum range. This build-up process has also been developed on medium CTE organic laminates including MCL-E-679F from Hitachi Chemical and PTFE laminates with Cu-Invar-Cu core. Embedded decoupling capacitors with capacitance density of >500nF/cm2 have been integrated into the build-up layers using sol-gel synthesized BaTiO3 thin films (200-300nm film thickness) deposited on copper foils and integrated using vacuum lamination and subtractive etch processes. Thin metal alloy resistor films have been integrated into the SOP substrate using two methods: (a) NiCrAlSi thin films (25ohms per square) deposited on copper foils (Gould Electronics) laminated on the build-up layers and two step etch process for resistor definition, and (b) electroless plated Ni-W-P thin films (70 ohms to few Kohms per square) on the BCB dielectric by plasma surface treatment and activation. The electrical design and build-up layer structure along- - with key materials and processes used in the fabrication of the SOP4 test vehicle were presented in this paper. Initial results from the high density wiring and embedded thin film components were also presented. The focus of this paper is on integration of materials, processes and structures in a single package substrate for system-on-a-package (SOP) implementation

Optimizing Delay in Sequential Change Detection on Ad Hoc Wireless Sensor Networks

We consider the classical problem of sequential detection of change in a distribution (from hypothesis 0 to hypothesis 1), where the fusion centre receives vectors of periodic measurements, with the measurements being i.i.d. over time and across the vector components, under each of the two hypotheses. In our problem, the sensor devices ("motes") that generate the measurements constitute an ad hoc wireless network. The motes contend using a random access protocol (such as CSMA/CA) to transmit their measurement packets to the fusion centre. The fusion centre waits for vectors of measurements to accumulate before taking decisions. We formulate the optimal detection problem, taking into account the network delay experienced by the vectors of measurements, and find that, under periodic sampling, the detection delay decouples into network delay and decision delay. We obtain a lower bound on the network delay, and propose a censoring scheme, where lagging sensors drop their delayed observations in order to mitigate network delay. We show that this scheme can achieve the lower bound. This approach is explored via simulation. We also use numerical evaluation and simulation to study issues such as: the optimal sampling rate for a given number of sensors, and the optimal number of sensors for a given measurement rate