18 resultados para 616.079


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This paper presents the steps and the challenges for implementing analytical, physics-based models for the insulated gate bipolar transistor (IGBT) and the PIN diode in hardware and more specifically in field programmable gate arrays (FPGAs). The models can be utilised in hardware co-simulation of complex power electronic converters and entire power systems in order to reduce the simulation time without compromising the accuracy of results. Such a co-simulation allows reliable prediction of the system's performance as well as accurate investigation of the power devices' behaviour during operation. Ultimately, this will allow application-specific optimisation of the devices' structure, circuit topologies as well as enhancement of the control and/or protection schemes.

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Robust climbing in unstructured environments has been one of the long-standing challenges in robotics research. Among others, the control of large adhesion forces is still an important problem that significantly restricts the locomotion performance of climbing robots. The main contribution of this paper is to propose a novel approach to autonomous robot climbing which makes use of hot melt adhesion (HMA). The HMA material is known as an economical solution to achieve large adhesion forces, which can be varied by controlling the material temperature. For locomotion on both inclined and vertical walls, this paper investigates the basic characteristics of HMA material, and proposes a design and control of a climbing robot that uses the HMA material for attaching and detaching its body to the environment. The robot is equipped with servomotors and thermal control units to actively vary the temperature of the material, and the coordination of these components enables the robot to walk against the gravitational forces even with a relatively large body weight. A real-world platform is used to demonstrate locomotion on a vertical wall, and the experimental result shows the feasibility and overall performances of this approach. © 2013 Elsevier B.V. All rights reserved.