4 resultados para Post-traumatic Stress Disorder

em Cambridge University Engineering Department Publications Database


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Interbedded layers of glacial deposits and marine or glacimarine clay layers are a common feature of offshore sediment. Typically, offshore marine clays are lightly overconsolidated sensitive clay. Some case histories on submarine landslides show that the slip surface passes through these marine clay layers. In this paper a model is proposed for post-peak strain softening behavior of marine sensitive clay. The slope failure mechanism is examined using the concept of shear band propagation. It is shown that shear band propagation and post-peak stress-strain behavior of clay layers are two major factors in submarine slope stability analysis. Copyright © 2012 by the International Society of Offshore and Polar Engineers (ISOPE).

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A new approach is presented to resolve bias-induced metastability mechanisms in hydrogenated amorphous silicon (a-Si:H) thin film transistors (TFTs). The post stress relaxation of threshold voltage (V(T)) was employed to quantitatively distinguish between the charge trapping process in gate dielectric and defect state creation in active layer of transistor. The kinetics of the charge de-trapping from the SiN traps is analytically modeled and a Gaussian distribution of gap states is extracted for the SiN. Indeed, the relaxation in V(T) is in good agreement with the theory underlying the kinetics of charge de-trapping from gate dielectric. For the TFTs used in this work, the charge trapping in the SiN gate dielectric is shown to be the dominant metastability mechanism even at bias stress levels as low as 10 V.

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In situ densification is a popular technique to protect shallow foundations from the effects of earthquake-induced liquefaction, current design being based on semiempirical rules. Poor understanding of the mechanisms governing the performance of soil-structure systems during and after earthquakes inhibits the use of narrow densified zones, which could contribute to optimise the use of densification if the increase in post-earthquake settlement is restrained. Therefore this paper investigates the long-term behaviour of a footing built on densified ground and surrounded by liquefiable ground, centrifuge experiments being used to identify the mechanisms occurring in the ground during and after a seismic simulation. The differential excess pore pressure generated in the ground during the shaking and the processes of vertical stress concentration and subsequent redistribution observed under the footing dominate the system behaviour. The results enlighten the complex mechanisms determining the post-earthquake settlement when densification is carried out to mitigate liquefaction effects. The improvement in performance resulting from widening the zone of densification is rationally explained which encourages the development of new design concepts that may enhance the future use of densification as a liquefaction resistance measure. © 2007 Thomas Telford Ltd.

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The successful utilization of an array of silicon on insulator complementary metal oxide semiconductor (SOICMOS) micro thermal shear stress sensors for flow measurements at macro-scale is demonstrated. The sensors use CMOS aluminum metallization as the sensing material and are embedded in low thermal conductivity silicon oxide membranes. They have been fabricated using a commercial 1 μm SOI-CMOS process and a post-CMOS DRIE back etch. The sensors with two different sizes were evaluated. The small sensors (18.5 ×18.5 μm2 sensing area on 266 × 266 μm2 oxide membrane) have an ultra low power (100 °C temperature rise at 6mW) and a small time constant of only 5.46 μs which corresponds to a cut-off frequency of 122 kHz. The large sensors (130 × 130 μm2 sensing area on 500 × 500 μm2 membrane) have a time constant of 9.82 μs (cut-off frequency of 67.9 kHz). The sensors' performance has proven to be robust under transonic and supersonic flow conditions. Also, they have successfully identified laminar, separated, transitional and turbulent boundary layers in a low speed flow. © 2008 IEEE.