A Colony Architecture for an Artificial Creature

This report describes a working autonomous mobile robot whose only goal is to collect and return empty soda cans. It operates in an unmodified office environment occupied by moving people. The robot is controlled by a collection of over 40 independent "behaviors'' distributed over a loosely coupled network of 24 processors. Together this ensemble helps the robot locate cans with its laser rangefinder, collect them with its on-board manipulator, and bring them home using a compass and an array of proximity sensors. We discuss the advantages of using such a multi-agent control system and show how to decompose the required tasks into component activities. We also examine the benefits and limitations of spatially local, stateless, and independent computation by the agents.

Site Controller: A System for Computer-Aided Civil Engineering and Construction

A revolution\0\0\0 in earthmoving, a $100 billion industry, can be achieved with three components: the GPS location system, sensors and computers in bulldozers, and SITE CONTROLLER, a central computer system that maintains design data and directs operations. The first two components are widely available; I built SITE CONTROLLER to complete the triangle and describe it here. SITE CONTROLLER assists civil engineers in the design, estimation, and construction of earthworks, including hazardous waste site remediation. The core of SITE CONTROLLER is a site modelling system that represents existing and prospective terrain shapes, roads, hydrology, etc. Around this core are analysis, simulation, and vehicle control tools. Integrating these modules into one program enables civil engineers and contractors to use a single interface and database throughout the life of a project.

Design and Control of an Anthropomorphic Robotic Finger with Multi-point Tactile Sensation

The goal of this research is to develop the prototype of a tactile sensing platform for anthropomorphic manipulation research. We investigate this problem through the fabrication and simple control of a planar 2-DOF robotic finger inspired by anatomic consistency, self-containment, and adaptability. The robot is equipped with a tactile sensor array based on optical transducer technology whereby localized changes in light intensity within an illuminated foam substrate correspond to the distribution and magnitude of forces applied to the sensor surface plane. The integration of tactile perception is a key component in realizing robotic systems which organically interact with the world. Such natural behavior is characterized by compliant performance that can initiate internal, and respond to external, force application in a dynamic environment. However, most of the current manipulators that support some form of haptic feedback either solely derive proprioceptive sensation or only limit tactile sensors to the mechanical fingertips. These constraints are due to the technological challenges involved in high resolution, multi-point tactile perception. In this work, however, we take the opposite approach, emphasizing the role of full-finger tactile feedback in the refinement of manual capabilities. To this end, we propose and implement a control framework for sensorimotor coordination analogous to infant-level grasping and fixturing reflexes. This thesis details the mechanisms used to achieve these sensory, actuation, and control objectives, along with the design philosophies and biological influences behind them. The results of behavioral experiments with a simple tactilely-modulated control scheme are also described. The hope is to integrate the modular finger into an %engineered analog of the human hand with a complete haptic system.

Motor Control and Learning by the State Space Model

A model is presented that deals with problems of motor control, motor learning, and sensorimotor integration. The equations of motion for a limb are parameterized and used in conjunction with a quantized, multi-dimensional memory organized by state variables. Descriptions of desired trajectories are translated into motor commands which will replicate the specified motions. The initial specification of a movement is free of information regarding the mechanics of the effector system. Learning occurs without the use of error correction when practice data are collected and analyzed.

Heterogeneous Multi-Robot Cooperation

This report addresses the problem of achieving cooperation within small- to medium- sized teams of heterogeneous mobile robots. I describe a software architecture I have developed, called ALLIANCE, that facilitates robust, fault tolerant, reliable, and adaptive cooperative control. In addition, an extended version of ALLIANCE, called L-ALLIANCE, is described, which incorporates a dynamic parameter update mechanism that allows teams of mobile robots to improve the efficiency of their mission performance through learning. A number of experimental results of implementing these architectures on both physical and simulated mobile robot teams are described. In addition, this report presents the results of studies of a number of issues in mobile robot cooperation, including fault tolerant cooperative control, adaptive action selection, distributed control, robot awareness of team member actions, improving efficiency through learning, inter-robot communication, action recognition, and local versus global control.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.