Further studies of epoxy bonding compounds. Physical research project no. 13


Autoria(s): Miklofsky, Haaren A.; Rensselaer Polytechnic Institute.
Data(s)

11/06/1963

Resumo

Mode of access: Internet.

Formato

ren

Identificador

http://hdl.handle.net/2027/coo.31924004135012

Idioma(s)

eng

Publicador

[Albany] Bureau of Physical Research,

Direitos

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Palavras-Chave #Sealing compounds #Epoxy compounds
Tipo

text