Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface


Autoria(s): Junior, Manoel M.; Rocha, Eduardo Passos; Anchieta, Rodolfo B.; Archangelo, Carlos Marcelo; Luersen, Marco Antonio
Contribuinte(s)

Universidade Estadual Paulista (UNESP)

Data(s)

30/09/2013

20/05/2014

30/09/2013

20/05/2014

01/06/2012

Resumo

The purpose of this study was to evaluate stress distribution in the hybrid layer produced by two adhesive systems using three-dimensional finite element analysis (FEA). Four FEA models (M) were developed: Mc, a representation of a dentin specimen (41 x 41 x 82 mu m) restored with composite resin, exhibiting the adhesive layer, hybrid layer (HL), resin tags, peritubular dentin, and intertubular dentin to simulate the etch-and-rinse adhesive system; Mr, similar to Mc, with lateral branches of the adhesive; Ma, similar to Mc, however without resin tags and obliterated tubule orifice, to simulate the environment for the self-etching adhesive system; Mat, similar to Ma, with tags. A numerical simulation was performed to obtain the maximum principal stress (sigma(max)). The highest sigma(max) in the HL was observed for the etch-and-rinse adhesive system. The lateral branches increased the sigma(max) in the HL. The resin tags had a little influence on stress distribution with the self-etching system. (C) 2012 Elsevier Ltd. All rights reserved.

Formato

114-119

Identificador

http://dx.doi.org/10.1016/j.ijadhadh.2011.11.012

International Journal of Adhesion and Adhesives. Oxford: Elsevier B.V., v. 35, p. 114-119, 2012.

0143-7496

http://hdl.handle.net/11449/15208

10.1016/j.ijadhadh.2011.11.012

WOS:000304580300016

Idioma(s)

eng

Publicador

Elsevier B.V.

Relação

International Journal of Adhesion and Adhesives

Direitos

closedAccess

Palavras-Chave #Finite element stress analysis #Mechanical properties of adhesives #Dentin bonding agents #Hybrid layer #Etch-and-rinse adhesives #Self-etch adhesives
Tipo

info:eu-repo/semantics/article