Using glyoxylic acid as a substitute for formaldehyde in electroless copper plating

Autoria(s): Wu, X.; Sha, Wei
Data(s)

01/03/2007
Identificador

http://pure.qub.ac.uk/portal/en/publications/using-glyoxylic-acid-as-a-substitute-for-formaldehyde-in-electroless-copper-plating(d085f904-1568-4c30-b6f5-e18c43987cbd).html
Idioma(s)

eng
Publicador

Unknown Publisher
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Wu , X & Sha , W , Using glyoxylic acid as a substitute for formaldehyde in electroless copper plating , 2007 , Exhibition , Unknown Publisher , Poster Competition .
Tipo

other
Acesso ao item digital