Novel Bonding Techniques using the Formation of NiSi and TiSi2


Autoria(s): Armstrong, Mervyn; Bain, Michael; Baine, Paul; Gamble, Harold
Data(s)

01/01/2005

Identificador

http://pure.qub.ac.uk/portal/en/publications/novel-bonding-techniques-using-the-formation-of-nisi-and-tisi2(0b4b165d-cc45-4d3b-a92e-e71b8aa054fa).html

Idioma(s)

eng

Direitos

info:eu-repo/semantics/restrictedAccess

Fonte

Armstrong , M , Bain , M , Baine , P & Gamble , H 2005 , ' Novel Bonding Techniques using the Formation of NiSi and TiSi2 ' Paper presented at EUROSOI 2005 First Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits , Granada , Spain , 01/01/2005 - 01/01/2005 , pp. 0-0 .

Tipo

conferenceObject