Process Modelling for Control of Product Wall Thickness in Thermoforming


Autoria(s): McCool, Rauri; Martin, Peter; Harkin-Jones, Eileen
Data(s)

2006

Identificador

http://pure.qub.ac.uk/portal/en/publications/process-modelling-for-control-of-product-wall-thickness-in-thermoforming(3dae1d24-1031-418a-8794-a0e5db5315f7).html

http://dx.doi.org/10.1179/174328906X143859

http://www.scopus.com/inward/record.url?scp=33751186517&partnerID=8YFLogxK

Idioma(s)

eng

Direitos

info:eu-repo/semantics/restrictedAccess

Fonte

McCool , R , Martin , P & Harkin-Jones , E 2006 , ' Process Modelling for Control of Product Wall Thickness in Thermoforming ' Plastics, Rubber And Composites: Macromolecular Engineering , vol 35 , no. 8 , pp. 340-347 . DOI: 10.1179/174328906X143859

Palavras-Chave #/dk/atira/pure/subjectarea/asjc/2500/2503 #Ceramics and Composites #/dk/atira/pure/subjectarea/asjc/2500/2507 #Polymers and Plastics #/dk/atira/pure/subjectarea/asjc/2500/2505 #Materials Chemistry
Tipo

article

Resumo

The present paper describes the results of an investigation into the modelling of plug assisted thermoforming. The objective of this work was to improve the finite element modelling of thermoforming through an enhanced understanding of the physical elements underlying the process. Experiments were carried out to measure the effects on output of changes in major parameters and simultaneously simple finite element models were constructed. The experimental results show that the process creates conflicting and interrelated contact friction and heat transfer effects that largely dictate the final wall thickness distribution. From the simulation work it was demonstrated that a high coefficient of friction and no heat transfer can give a good approximation of the actual wall thickness distribution. However, when conduction was added to the model the results for lower friction values were greatly improved. It was concluded that further work is necessary to provide realistic measurements and models for contact effects in thermoforming.