Variable frequency microwave curing of polymer materials in microelectronics packaging applications
| Data(s) |
2007
|
|---|---|
| Resumo |
The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system |
| Formato |
application/pdf |
| Identificador |
http://gala.gre.ac.uk/1117/1/07_53.pdf Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975 <http://doi.org/10.1109/EPTC.2007.446975>) |
| Idioma(s) |
en |
| Publicador |
Institute of Electrical and Electronics Engineers, Inc. |
| Relação |
http://gala.gre.ac.uk/1117/ http://ieeexplore.ieee.org/Xplore/login.jsp?url=http://ieeexplore.ieee.org/iel5/4455348/4469670/04469757.pdf%3Farnumber%3D4469757&authDecision=-203 10.1109/EPTC.2007.446975 |
| Palavras-Chave | #TK Electrical engineering. Electronics Nuclear engineering #QA75 Electronic computers. Computer science |
| Tipo |
Book Section PeerReviewed |
