Water Vapor Barrier Material by Covalent Self-Assembly for Organic Device Encapsulation


Autoria(s): Kopanati, Gayathri N; Seethamraju, Sindhu; Ramamurthy, Praveen C; Madras, Giridhar
Data(s)

2014

Resumo

Development of barrier materials for organic device encapsulation is of key interest for the commercialization of organic electronics. In this work, we have fabricated barrier films with ultralow water vapor permeabilities by reactive layer-by-layer approach. Using this technique, alternative layers of polyethylene imine and stearic acid were covalently bonded on a Surlyn film. The roughness, transparency and thickness of the films were determined by atomic force microscopy, UV-visible spectroscopy and scanning electron microscopy, respectively. Water vapor transmission rates through these films and the ability of these films to protect the organic photovoltaic devices was investigated. The films with covalently assembled bilayers exhibited lower water vapor transmission rates and maintained higher organic photovoltaic device efficiencies compared to the neat Surlyn film.

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/50576/1/ind_eng_che_res_53-46_17894_2014.pdf

Kopanati, Gayathri N and Seethamraju, Sindhu and Ramamurthy, Praveen C and Madras, Giridhar (2014) Water Vapor Barrier Material by Covalent Self-Assembly for Organic Device Encapsulation. In: INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 53 (46). pp. 17894-17900.

Publicador

AMER CHEMICAL SOC

Relação

http://dx.doi.org/ 10.1021/ie5036995

http://eprints.iisc.ernet.in/50576/

Palavras-Chave #Chemical Engineering #Materials Engineering (formerly Metallurgy) #Centre for Nano Science and Engineering
Tipo

Journal Article

PeerReviewed