Miniaturized Defected Ground High Isolation Crossovers


Autoria(s): Packiaraj, D; Vinoy, KJ; Nagarajarao, P; Ramesh, M; Kalghatgi, AT
Data(s)

2013

Resumo

This letter relates to the design of crossovers for carrying criss crossing signals. Two types of crossovers are proposed in this letter. Both the crossovers are designed using a two layer printed circuit board. An unbroken continuous transmission line is routed in the top layer for carrying signal 1 from one node to another node. Transmission line used for carrying a signal 2 consists of three physically discontinuous, but electrically connected segments. Two end segments of these are located in the top layer while the middle segment is placed in the bottom layer. While Type I crossover offers an isolation of 25 dB, Type II crossover offers isolation better than 35 dB from dc to 10 GHz. These crossovers are compact and measure an actual size of 10 x 10 x 0.78 mm(3).

Formato

application/pdf

Identificador

http://eprints.iisc.ernet.in/47045/1/ieee_mic_wir_com_let-23_2013.pdf

Packiaraj, D and Vinoy, KJ and Nagarajarao, P and Ramesh, M and Kalghatgi, AT (2013) Miniaturized Defected Ground High Isolation Crossovers. In: IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 23 (7). pp. 347-349.

Publicador

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

Relação

http://dx.doi.org/10.1109/LMWC.2013.2263219

http://eprints.iisc.ernet.in/47045/

Palavras-Chave #Electrical Communication Engineering
Tipo

Journal Article

PeerReviewed