Microstructure and compression behavior of chip consolidated magnesium
Data(s) |
01/02/2012
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Resumo |
Chips produced by turning a commercial purity magnesium billet were cold compacted and then hot extruded at four different temperatures: 250, 300, 350, and 400 degrees C. Cast billets, of identical composition, were also extruded as reference material. Chip boundaries, visible even after 49: 1 extrusion at 400 degrees C, were observed to suppress grain coarsening. Although 250 degrees C extruded chip-consolidated product showed early onset of yielding and lower ductility, fully dense material (extruded at 400 degrees C) had nearly 40% reduction in grain size with 22% higher yield strength and comparable ductility as that of the reference. The study highlights the role of densification and grain refinement on the compression behavior of chip consolidated specimens. |
Formato |
application/pdf |
Identificador |
http://eprints.iisc.ernet.in/44637/1/jou_mat_res_27-4_709-719_2012.pdf Anilchandra, Adamane R and Basu, Ritwik and Samajdar, Indradev and Surappa, Mirle K (2012) Microstructure and compression behavior of chip consolidated magnesium. In: JOURNAL OF MATERIALS RESEARCH, 27 (4). pp. 709-719. |
Publicador |
Cambridge University Press |
Relação |
http://dx.doi.org/10.1557/jmr.2011.411 http://eprints.iisc.ernet.in/44637/ |
Palavras-Chave | #Materials Engineering (formerly Metallurgy) |
Tipo |
Journal Article PeerReviewed |